Xiaomi has been refining its foldable lineup since the first Mi Mix Fold, gradually focusing on thinner designs and more capable hardware with each generation. However, the company is now taking a different approach with its next foldable. It will not be called the Xiaomi Mix Fold 5, as previously expected based on its predecessor, the Xiaomi Mix Fold 4. Instead, it will launch as the Xiaomi 18 Fold.
Key Highlights
- The Xiaomi 18 Fold is confirmed to launch in China in September.
- It will be powered by Xiaomi’s new 3nm Xring O3 chipset.
- Xiaomi claims the chip has surpassed 5.2 million points on AnTuTu.
Xiaomi has officially confirmed the new name, along with a September launch in China. The Xiaomi 18 Fold will also be the first smartphone to feature the company’s new Xring O3 chipset, succeeding last year’s Xring O1. Xiaomi has already started accepting pre-orders for the foldable in China, although the complete specifications and pricing are yet to be revealed. So, here’s everything we know about Xiaomi’s latest foldable so far.
Xiaomi 18 Fold Overview
Design and Display
Xiaomi has shown a glimpse of the 18 Fold, revealing a shorter and wider book-style foldable design. This marks a noticeable change from the relatively narrow form factor used by earlier Mix Fold models and should make the outer display feel more conventional when the phone is folded.
The company has not yet revealed the complete display specifications. However, recent leaks point toward a 7.76-inch inner display with a 2713 × 1920-pixel resolution, while the cover screen could measure 6.56 inches. Both panels are expected to use LTPO technology with refresh rates of up to 120Hz, although Xiaomi has not confirmed these specifications yet.
The 18 Fold could also feature Xiaomi’s newer waterdrop hinge, which may help reduce the visible crease while allowing the device to maintain a slimmer profile. An IP68 rating for dust and water resistance has also been tipped, but this remains unconfirmed for now.
Performance and Xring O3
The biggest highlight of the Xiaomi 18 Fold is undoubtedly its new Xring O3 chipset. Built using TSMC’s 3nm process, the chip measures around 133mm² and contains approximately 24 billion transistors, making it significantly larger and more complex than its predecessor.
The Xring O3 features a 10-core CPU arranged across three different core types. It includes two C1-Ultra cores clocked at up to 4.35GHz, four C1-Premium cores reaching 3.68GHz, and four C1-Pro cores with a maximum clock speed of 3.15GHz.
For graphics, the chipset is paired with a 16-core G2-Ultra NX GPU. Xiaomi claims the Xring O3 achieved 5,228,014 points on AnTuTu, crossing the five-million mark in the company’s testing.
The Xring O3 is particularly important for Xiaomi because the 18 Fold will be the first smartphone to debut with the chipset. Xiaomi is positioning the processor as a major step forward for its in-house silicon, rather than simply treating it as another incremental upgrade.
The Xring O3 is also part of Xiaomi’s broader push into custom silicon. Alongside the smartphone-focused O3, the company has introduced the Xring O100 for AI workloads and the Xring D100 for automotive applications. These are separate chips rather than additional processors inside the 18 Fold.
Camera
Xiaomi has not officially revealed the 18 Fold’s camera specifications yet. However, leaks suggest that the foldable could feature a 200MP Leica-branded primary camera, accompanied by two telephoto cameras.
This would give the 18 Fold a potentially strong camera setup for a foldable, particularly if Xiaomi manages to balance the larger sensors and telephoto hardware with the phone’s slimmer design.
That said, these camera details remain unconfirmed, so the final configuration could differ when Xiaomi officially unveils the phone.
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Battery
The Xiaomi 18 Fold is rumored to pack a 6,000mAh battery, which would be a notable capacity for a foldable of this size. It is also expected to support 100W wired and 50W wireless charging.
However, Xiaomi has not officially confirmed either the battery capacity or charging speeds yet. We will have to wait for the full launch announcement to know whether these specifications make it to the final device.
Xiaomi 18 Fold Specifications (Rumours)
- Design, build: Wide book-style foldable design, IP68 rated
- Inner display: 7.76-inch, 2713 × 1920 pixels, LTPO, up to 120Hz
- Cover display: 6.56-inch, LTPO, up to 120Hz
- Chipset: Xiaomi Xring O3 (3nm), 10-core CPU, up to 4.35GHz, 16-core G2-Ultra NX
- Memory: LPDDR6 support, RAM/storage configurations TBA
- Software & UI: HyperOS 4 based on Android 17
- Rear Cameras: Triple (200MP primary, dual telephoto)
- Front Camera: TBA
- Security: Fingerprint (Side-mounted)
- Connectivity: 5G, USB-C, NFC
- Battery: 6000mAh with 100W wired and 50W wireless charging
Xiaomi 18 Fold Price and Availability
Xiaomi has confirmed that the 18 Fold will launch in China in September 2026, although the exact launch date has yet to be announced. Pricing and global availability are also still unknown.
Since Xiaomi’s previous book-style foldables have largely been focused on the Chinese market, its availability outside China remains uncertain. We will update this section once Xiaomi announces the official pricing and availability for Nepal.
Article Last updated: August 25, 2026
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