The world’s biggest smartphone chip supplier MediaTek has added a new processor to its arsenal, called the MediaTek Dimensity 1050. it is the company’s first chipset to feature both sub-6Hz and mmWave 5G connectivity.
MediaTek Dimensity 1050 Overview:
Seamless 5G Connectivity
The Dimensity 1050 can seamlessly switch between long-range sub-6GHz and super-fast mmWave 5G connections. According to MediaTek, the chipset can deliver up to 53% faster speeds than LTE + mmWave aggregation.
Furthermore, it employs the most recent 3CC-CA connectivity technology in sub-6GHz exclusive areas to achieve downlink speeds of up to 4.6Gbps. The chipset also includes the most recent Wi-Fi 6E, which introduces tri-band connectivity.
Architecture
MediaTek Dimensity 1050 is built on top of TSMC’s N6 (6nm) manufacturing process. It is an octa-core chip with two Cortex-A78 cores with up to 2.5GHz clock speeds and six Coretex-A55 cores with up to 2.0GHz clock speeds.
MediaTek has included an ARM Mali-G610 graphics processor. Furthermore, it supports the in-house HyperEngine 5.0, which introduces additional resource management features for gaming. Likewise, the chip is compatible with LPDDR5 memory and UFS 3.1 storage.
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Rest of the specs
MediaTek Dimensity 1050 supports Full HD+ displays with refresh rates of up to 144Hz. There is also native 10-bit color support, as well as HDR10+ Adaptive, CUVA HDR-vivid, HLG, and Dolby Vision.
Dimensity 1050-powered phone will also be capable of adaptive refresh rate thanks to the Intelligent Display Sync technology.
MediaTek Dimensity 1050 also has a dedicated APU for AI-related processing tasks. All of the chip’s AI requirements are fulfilled by MediaTek APU 550. This enables smartphone manufacturers to use sensors with resolutions of up to 108MP in conjunction with AI noise reduction. Dual HDR video capture is also possible with the Imagiq 760 HDR-ISP.
MediaTek Dimensity 1050 SoC Specifications:
- Process: TSMC 6nm process
- Core Architecture: 2x 2.5GHz Cortex-A78 + 6x 2.0GHz Cortex-A55
- GPU: Arm Mali-G610 MC3
- AI: MediaTek APU 550
- Memory Support: LPDDR5, LPDDR4X
- Max Camera: 108MP single camera
- Video Support: AV1 video decoding, HDR10+ playback, and Dolby Vision
- Display Support: 144Hz Full HD+
- Connectivity: Wi-Fi 6E, Bluetooth 5.2
MediaTek Dimensity 1050 Launch and Availability
MediaTek has confirmed that smartphones powered by the Dimensity 1050 will be available between July and September of 2022. We can expect Vivo, Realme, Xiaomi, Oppo, and OnePlus to be among the first to use the chipset.
- Meanwhile, check out our review of the Realme Pad Mini.
