Mediatek has recently announced Dimensity 800 under the new Dimesity lineup of smartphone chipsets. The announcement was made at MediaTek’s Product Communication Conference. The chipset is aimed at the mid-range and upper mid-range segment of the market. The MediaTek Dimensity 800 will be officially launched in the first quarter of 2020 and we will probably see the phones powered by it in the third quarter of 2020; if not later.
The Dimensity Series
MediaTek launched the new Dimensity series in November. The first chip from the series –Dimensity 1000 came soon after the company’s partnership with Intel was official. The Dimensity 1000 is built on the 7nm process and comes with 8 cores (4× 2.6 GHz Cortex-A77 + 4× 2.0 GHz Cortex-A55). Upon its release, MediaTek claimed that it was the most power-efficient 5G chip in the smartphone world. The Helio M70 5G modem integrated into the chip resulted in a compact chip with the added advantage of power efficiency.
With the launch of the Oppo Reno3 5G, we also came across Mediatek’s Dimensity 1000L. The 7nm chipset comes with 8 Cores (4 x 2.2 GHz Cortex-A77 + 4 x 2.0 GHz Cortex-A55 ). Other than the low clocked performance cores, it shares many of its specs with Dimensity 1000. There’s also the Helio M70 modem integrated for 5G connectivity.
The Dimensity 800
Though MediaTek hasn’t revealed anything about the Dimensity 800, rumors have already started circulating the internet about its alleged specs.
The model number of the chip is thought to be MT6873. As we can guess from the moniker, the new Dimensity 800 will pack less power than the previous Dimensity 1000 5G. It is said to be an octa-core chip (2 x A76 cores + 6 x A55 cores).
According to MyDrivers, the Dimensity 800 will be based on the same architecture as the Dimensity 1000L chip but will be smaller with reduced manufacturing cost than the latter. The Dimensity 800 will also come with dual-mode 5G support as in the Dimensity 1000 and the Dimensity 1000L. It might even feature the Helio M70 modem that we saw in the previous chips.
Launch And Competitors
The Dimensity 800 will first be presented at CES 2020. The company is set to start mass production of the new Dimensity 800 in the second quarter of 2020. We might start seeing smartphones powered by this chip in the third quarter of 2020. The chip will compete against Kirin 800 series and Qualcomm’s Snapdragon 7-series.